Printed Circuits Handbook 5th Edition

Item No. : B - 00177
Harga Ebook/Ebuku : Rp. 50.000,-
(belum termasuk biaya kirim dalam bentuk CD/DVD)
Ongkos kirim dalam pulau Jawa & luar pulau Jawa lihat halaman pemesanan
Isi EBook/EBuku : 1344 halaman
Format PDF | Bahasa Inggris | Copyright © 2001

 

Daftar Isi EBook/EBuku :

1. Electronic Packaging and High-Density Interconnectivity
2. Semiconductor Packaging Technology
3. Advanced Packaging
4. Types of Printed Wiring Boards
5. Introduction to Base Materials
6. Base Material Components
7. Base Material Manufacturing Processes
8. Properties of Base Materials
9. Densification Issues for Base Materials
10. Introducing Base Materials into the PCB Manufacturing Process
11. HDI Microvia Materials
12. Laminate Qualification and Testing
13. Physical Characteristics of PCB
14. The PCB Design Process
15. Electrical and Mechanical Design Parameters
16. Controlled Impedance
17. Multilayer Design Issues
18. Planning for Design, Fabrication, and Assembly
19. Manufacturing Information Documentation and Transfer
20. Electronic Contract Manufacturing Supplier Selection and Management
21. Introduction to High-Density Interconnection Technology
22. High-Density Interconnect-Build-up Technologies
23. Microvia Hole Technologies
24. Drilling Processes
25. High-Density Interconnect Drilling
26. Imaging
27. Multilayer Materials and Processing
28. Preparing Boards for Plating
29. Electroplating
30. Direct Plating
31. PWB Manufacture Using Fully Electroless Copper
32. Surface Finishes
33. Etching Process and Technologies
34. Solder Resist Material and Processes
35. Machining and Routing
36. Process Capability and Control
37. Bare Board Test Objectives and Definitions
38. Bare Board Test Methods
39. Bare Board Test Equipment
40. HDI Bare Board Special Testing Methods
41. Assembly Processes
42. Design for Soldering and Solderability
43. Solder Materials and Processes
44. No-Clean Assembly Process
45. Lead-Free Soldering
46. Fluxes and Cleaning
47. Press-Fit Connections
48. Acceptability of Fabricated Boards
49. Acceptability of Printed Circuit Board Assemblies
50. Assembly Inspection
51. Design for Testing
52. Loaded Board Testing
53. Reliability of Printed Circuit Assemblies
54. Component-to-PWB Reliability
55. Process Waste Minimization and Treatment
56. Flexible Circuits: Applications and Materials
57. Design of Flexible Circuits
58. Manufacturing of Flexible Circuits
59. Termination of Flexible Circuits
60. Special Constructions of Flexible Circuits
61. Quality Assurance of Flexible Circuits


Deskripsi EBook/EBuku :

Buku ini sebagai pegangan yang pasti untuk kerja atau eksperimen dengan pemancar dan disertai gambar, skematik dan diagram. Nilainya sangat berguna bagi enginer, teknisi, radio amatir, pelajar, Hobi dan semua teknisi yang mengerti tentang pemancar. Banyak diulas penjabaran tentang antena dan rumus perhitungan dalam rangkaian pemancar. Buku ini memiliki nilai yang sangat tinggi bagi orang yang ingin mengetahui tentang pemancar, dan digunakan sebagai penuntun untuk membuat pemancar serta eksperimen bagi pemula.

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