Printed Circuit Handbook

Item No. : B - 00045
Harga Ebook/Ebuku : Rp. 50.000,-
(belum termasuk biaya kirim dalam bentuk CD/DVD)
Ongkos kirim dalam pulau Jawa & luar pulau Jawa lihat halaman pemesanan
Isi EBook/EBuku : 1633 Halaman
Format PDF | Bahasa Inggris | Copyright © 2008

 

Daftar Isi EBook/EBuku :

1. Legislation and Impact on Printed Circuits
2. ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY
3. Semiconductor Packaging Technology
4. Advanced Component Packaging
5. Types of Printed Wiring Boards
6. Introduction to Base Materials
7. Base Material Components
8. Properties of Base Materials
9. Base Materials Performance Issues
10. The Impact of Lead-Free Assembly on Base Materials
11. Selecting Base Materials for Lead-Free Assembly Applications
12. Laminate Qualification and Testing
13. Physical Characteristics of the PCB
14. The PCB Design Process
15. Electrical and Mechanical Design Parameters
16. Current Carrying Capacity in Printed Circuits
17. PCB Design for Thermal Performance
18. Information Formating and Exchange
19. Planning for Design, Fabrication, and Assembly
20. Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly
21. Embedded Components
22. Introduction to High-Density Interconnection (HDI) Technology
23. Advanced High-Density Interconnection (HDI) Technologies
24. Drilling Processes
25. Precision Interconnect Drilling
26. Imaging
27. Multilayer Materials and Processing
28. Preparing Boards for Plating
29. Electroplating
30. Direct Plating
31. PWB Manufacture Using Fully Electroless Copper
32. Printed Circuit Board Surface Finishes
33. Solder Mask
34. Etching Process and Technologies
35. Machining and Routing
36. Bare Board Test Objectives and Definitions
37. Bare Board Test Methods
38. Bare Board Test Equipment
39. HDI Bare Board Special Testing Methods
40. Assembly Processes
41. Conformal Coating
42. Solderability: Incoming Inspection and Wet Balance Technique
43. Fluxes and Cleaning
44. Soldering Fundamental
45. Soldering Materials and Metallurgy
46. Solder Fluxes
47. Soldering Techniques
48. Soldering Repair and Rework
49. Press-Fit Interconnection
50. Land Grid Array Interconnect
51. Acceptability and Quality of Fabricated Boards
52. Acceptability of Printed Circuit Board Assemblies
53. Assembly Inspection
54. Design for Testing
55. Loaded Board Testing
56. Conductive Anodic Filament Formation
57. Reliability of Printed Circuit Assemblies
58. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
59. Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders
60. Process Waste Minimization and Treatment
61. Flexible Circuit Applications and Materials
62. Design of Flexible Circuits
63. Manufacturing of Flexible Circuits
64. Termination of Flexible Circuits
65. Multilayer Flex and Rigid/Flex
66. Special Constructions of Flexible Circuits
67. Quality Assurance of Flexible Circuits


Deskripsi EBook/EBuku :

Buku ini sebagai pegangan yang pasti untuk kerja atau eksperimen dengan pemancar dan disertai gambar, skematik dan diagram. Nilainya sangat berguna bagi enginer, teknisi, radio amatir, pelajar, Hobi dan semua teknisi yang mengerti tentang pemancar. Banyak diulas penjabaran tentang antena dan rumus perhitungan dalam rangkaian pemancar. Buku ini memiliki nilai yang sangat tinggi bagi orang yang ingin mengetahui tentang pemancar, dan digunakan sebagai penuntun untuk membuat pemancar serta eksperimen bagi pemula.

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